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Cadence University Software Program

LASSP
Cadence University Program Member

Cornell University’s School of Engineering (Department of Electrical and Computer Engineering (ECE)), Laboratory of Atomic & Solid State Physics (LASSP), Laboratory for Elementary Particle Physics (LEPP), and the Cornell High Energy Synchrotron Source (CHESS), use real world CAD tools and methodologies provided by the Cadence University Program in our instruction and academic research.

Research areas at Cornell which utilize Cadence software include the following:

  • Integration of NEMS/MEMS with CMOS
  • International Linear Collider
  • DSP and Number System Research
  • Superconducting Radio-Frequency cavity
  • CMOS Imaging Array Research
  • VLSI Systems Design
  • Cornell Electron Storage Ring
  • Analog and RF Circuit Design
  • Energy Recovery Linac

Within LASSP, Cadence tools will be used to help students learn how to design and integrate MEMS and NEMS structures with CMOS. A brief project description follows.

CMOS Integration of High Frequency Micro and Nanomechanical Devices

Goal of the project:

To develop novel RF electro-mechanical systems based on fully CMOS integrated high frequency (f > 10MHz), high quality factor (Q > 1000) nanomechanical resonators. Such structures will supplant off-chip frequency-determining elements (quartz crystals, SAW, FBAR etc.) and will lead to implementation of new methods for sensing and signal processing.

Design and implementation of the CMOS-integrated nanomechanical resonators requires joint expertise in Mechanics, Solid State Physics and Electrical Engineering, as well as state-of-the-art tools for design, simulation and nanofabrication. Students in LASSP and the School of Applied & Engineering Physics at Cornell will have the opportunity to use software developed by Cadence Design Systems for the full flow of the custom IC design. (Classes at Cornell that provide training with Cadence tools are listed below). The project starts with the layout for the nanomechanical devices, followed by the design, simulation and layout of the RF analog circuits dedicated to signal transduction that will implement the interface between RF circuitry and the mechanical structures. Multiplexing, signal conditioning and further processing will require mixed-signal implementations. Deep submicron technologies at CMOS foundries are used for the fabrication. Post-processing steps that are necessary for the release and encapsulation of the nanomechanical structures are implemented at Cornell NanoScale Science and Technology Facilities (CNF) and at the Institute for NanoScience (NSI) at the Naval Research Laboratory.

ReichenbachMEMS.jpg

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fully intregrated bridge device
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double clamped beam test structure
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centrally clamped plate (mushroom) resonators
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centrally clamped plate (mushroom) resonators
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layout of double-poly dome resonator and cross sections
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References:

  • R. B. Reichenbach, M. Zalalutdinov, J. M. Parpia, and H. G. Craighead, “A RF MEMS Oscillator with Integrated Resistive Transduction,” Electron Device Lett., Vol. 27 No 10, pp. 805-07 2006.
  • R. B. Reichenbach, M. Zalalutdinov, K. L. Aubin, R. Rand, B. H. Houston, J. M. Parpia, H. G. Craighead, “Third-order intermodulation in a micromechanical thermal mixer,” Journal of Microelectromechanical Systems, Volume 14, Issue 6, Page(s): 1244-1252, Dec. 2005.
  • M. Zalalutdinov, J. W. Baldwin, M. H. Marcus, R. B. Reichenbach, J. M. Parpia and B. H. Houston, “Two-dimensional array of coupled nanomechanical resonators,” App. Phys. Lett. 88, 143504, 2006.
  • M. Zalalutdinov, K. Aubin, R. Reichenbach, A. Zehnder, B. Houston, J. Parpia, H.G. Craighead, “Shell-type Micromechanical Actuator and Resonator micromechanical oscillator” Appl. Phys. Lett. 83 (18): 3815-3817, 2003.
  • H. G. Craighead, “Nanoelectromechanical systems,” Science 290, 1532 (2000).

List of courses at Cornell providing familiarity with Cadence tools:
ECE 314 - Computer Organization
ECE 474 - Introduction to Digital VLSI Design
ECE 491/492 - Senior Electrical and Computer Engineering Project
ECE 574 - Advanced Digital VLSI Design.  Last Updated: 10/16/2007

Faculty directly involved in this research are Jeevak Parpia (LASSP) and Harold Craighead (A&EP). For questions regarding this website please contact: bi22@cornell.edu, mz37@cornell.edu.

Cadence is a registered trademark of:
Cadence Design Systems, Inc. (http://www.cadence.com/)
2655 Seely Avenue
San Jose, CA 95134

Updated 10/16/07